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sumitomo g770hcd

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sumitomo g770hcd

Abstract: G770H Wire: Au wire 1.0 mil Assembly Materials 8200T Au wire 1.0 mil Mold Compound: Sumitomo G770HC G770HCD Lead Frame: Copper Alloy Copper Alloy Plating: Matte 100% Sn (Green) Matte 100% Sn
Integrated Device Technology
Original
JESD22-A110 9UMS9610BKLFT 9UMS9610CKLFT 9UMS9633BKILF sumitomo g770hcd G770H QMI519 Sumitomo G770HC G770* sumitomo A0907-03 VFQFPN-48 MI519 P08-08-02 VFQFPN-64 VFQFPN-72

SUMITOMO CRM1076

Abstract: sumitomo g770hcd 0.9 mil, 0.8 mil Assembly Materials Mold Compound: Sumitomo G770HC, G770HCD, Sumitomo G700LY
Integrated Device Technology
Original
SUMITOMO CRM1076 JESD22-A113 SUMITOMO G631H cel9220 JESD22-A118 JESD22-A103 A1004-01R1 VFQFP-N-32 9LRS4105BKLF 9LRS4105BKLFT 9LRS4107AKLF 9LRS4107AKLFT

JESD22-A118

Abstract: SUMITOMO G631H Compound: Sumitomo G770HC, G770HCD, Sumitomo G700LY G770 series, CEL9220, G700 series, G631H Lead
Integrated Device Technology
Original
Ablebond 8600 SUMITOMO G700 sumitomo g770 sumitomo G700ly vfqfpn-32 cel-9220 A1004-01 9LRS4110BKLF 9LRS4110BKLFT 9LRS4111BKLF 9LRS4111BKLFT 9LRS4112BKLF