500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Top Results

Part Manufacturer Description Datasheet BUY
ABC13G-7000 TE Connectivity (ABC13G-7000) RECP ASSY visit TE Connectivity

sumitomo G700

Catalog Datasheet MFG & Type PDF Document Tags

PCN0602

Abstract: sumitomo G700 Change Description: Altera is adopting the Sumitomo G700 series mold compound as the standard mold , . Reason for Change: Altera is standardizing on the Sumitomo G700 series mold compound for all of its , Aug 2006 timeframe. Beginning with the top-mark date code of 0631, products molded with Sumitomo G700 , Qualification Data for the Sumitomo G700 Series Mold Compound Representative Package Read Out Results , for the Sumitomo G700 Series Mold Compound Material Properties Epoxy Hardener Filler Type Filler
Altera
Original

PCN0702

Abstract: SUMITOMO G700 MP8000CH4 The Sumitomo G600 and G700 mold material has been fully qualified by Altera. The qualification , compound material for all PDIP and RQFP packages assembled in Amkor to Sumitomo G600 and G700 , Appendixes 09/17/07 PCN0702 Appendix 1 Qualification Data for the Sumitomo G700 Series Mold Compound , -0 , UL-94 % weight gain ppm ppm Sumitomo G700 series 100 30 1.0 4.7 130 80 x 10-2 180 22
Altera
Original
G700M 2000HG SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 6300HJ 6300H EME-6300H DMC-2000HG

PCN0903

Abstract: Hitachi Datecode Compound Die Attach Epoxy Au Bondwire Diameter PQFP 100 Sumitomo G700 Ablestik 2288A 1.2 mils Altera Corporation Additional Source ATK (Korea) 3 Sumitomo G700 Ablestik 3230 1.0 mils 11
Altera
Original
PCN0903 EPC16UI88AA EPC8QI100N Hitachi Datecode Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D EPC16QC100 EPC16QC100DM EPC16QC100II EPC16QC100N EPC16QI100

SUMITOMO G700

Abstract: SUMITOMO EME G700 (Typ) 0.22 +/- 0.05 0.01+0.05, (-0.00) 25um Au Ablebond A2200 Sumitomo G700 100% Matte Sn 63/37 , 84-1 LMIS R4 Sumitomo EME 6600H 100% Matte Sn 63/37 Sn/Pb Laser Amkor ­ Philippines Catalyst
Mindspeed Technologies
Original
M02066-82 M02068G-15-T sumitomo 6600h G700 84-1 LMIs G700 SUMITOMO G700* sumitomo CN-092309 M02066G-82 M02068-15-T

92HD80B1X5

Abstract: SUMITOMO G631 Hitachi EN4900 Mold Compound: Sumitomo G700 Lead Frame: Copper Alloy Plating: Matte 100% Sn Page 2 of 4 Sumitomo G631 Copper Alloy Matte 100% Sn Integrated Device Technology, Inc. 6024
Integrated Device Technology
Original
92HD80B1X5NLGXTAX 92HD80B1X5 SUMITOMO G631 92HD79B1a5 92hd80 92hd80b1x5nlg 92HD80B1 A1007-01 VFQFPN-48 92HD80B1X5NLGXTA88 92HD80B1X5NLGXTAX8 92HD80B1X5NLGXYD1

sumitomo G700

Abstract: sumitomo epoxy 1076 Sensitivity (JEDEC J-STD20A) Date Code Range: ASE 28 TSOP 8x13.4x0.965 Sumitomo G700 Stamped Alloy 42 Sn Plate 100% Matte Sumitomo 1076 DS Au / 1.0 mil UL 94-V0 Level 3 0429 to 0429 , ) 28 TSOP 8x13.4x0.965 Sumitomo 7351T Stamped Copper C7025 SnPb Plate 8361J Epoxy Silverfilled , ATK (Amkor, K) 32 TSOP 8x20x1.0 Sumitomo 7351T Stamped Copper C7025 SnPb Plate 8361J Epoxy , Range: ATP (Amkor, PI) 28 TSOP 8x13.4x0.965 Sumitomo 7351T Stamped Copper C7025 SnPb Plate
Maxim Integrated Products
Original
sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 g700 mold compound Compound c7025 30C/60

CRM1076E

Abstract: STMicroelectronics TRACEABILITY code Sensitivity Level 3 as defined in JEDEC standard J-STD-020A. UMC Die Attach Mold Compound Sumitomo 8361J Nitto MP8000 Sumitomo 8361J Nitto MP8000 Sumitomo 84-1MIS Nitto MP8000 Ablestik 8361J Sumitomo 7320 STMicroelectronics Die Attach Mold Compound Sumitomo CRM1076E Sumitomo G-600 Sumitomo CRM1076E Sumitomo G-600 Sumitomo CRM1076E Sumitomo G-600 Ablestik 3230 AA Sumitomo G-700 Package PC20 PC44 SO20 VQ44 Products
Xilinx
Original
STMicroelectronics TRACEABILITY code XC18V02VQ44C part marking stmicroelectronics traceability XC18V04VQ44C0901 sumitomo g700 type datecode format stmicroelectronics XC18V00 DS026 JESD46B 5PM5A0233 5BM5A0233 SCD0901

CRM1064

Abstract: SUMITOMO G700 materials will be changed as follows: Mold compound : from Sumitomo green G700 to Sumitomo green G700A Die attach material: from Sumitomo CRM1064B to Ablestik 2288A REASON FOR CHANGE: Supplier's decision to
Exar
Original
CRM1064 ablestik 2288a CRM-1064 G700 mold compound Sumitomo Ablestik sumitomo g700 mold compound XRT72L52IQ-F XRT72L52IQTR-F G0006-6

JESD22-A118

Abstract: SUMITOMO G631H Compound: Sumitomo G770HC, G770HCD, Sumitomo G700LY G770 series, CEL9220, G700 series, G631H Lead
Integrated Device Technology
Original
JESD22-A118 SUMITOMO G631H Ablebond 8600 sumitomo g770hcd SUMITOMO CRM1076 sumitomo g770 A1004-01 VFQFP-N-32 9LRS4105BKLF 9LRS4105BKLFT 9LRS4107AKLF 9LRS4107AKLFT

SUMITOMO CRM1076

Abstract: sumitomo g770hcd 0.9 mil, 0.8 mil Assembly Materials Mold Compound: Sumitomo G770HC, G770HCD, Sumitomo G700LY G770 series, CEL9220, G700 series, G631H Lead Frame: Copper Alloy Copper Alloy Plating: Sn/Pb
Integrated Device Technology
Original
JESD22-A113 JESD22-A103 G770* sumitomo 9LvS3199aklft sumitomo G700ly en4900f A1004-01R1 9LRS4110BKLF 9LRS4110BKLFT 9LRS4111BKLF 9LRS4111BKLFT 9LRS4112BKLF

HMC916LP3

Abstract: SUMITOMO EME G700 using 1 mil gold ball bonds. The part is encapsulated using Sumitomo EME G700 or equivalent epoxy
Analog Devices
Original
HMC905LP3 HMC916LP3 hmc424lp3e HMC424LP3E HMC536LP2 HMC546LP2 HMC646LP2 HMC652LP2 HMC653LP2

STMicroelectronics marking code date

Abstract: CHN G4 bonding Mold Compound Type KE 3300 D G700 Toshiba Sumitomo Lead Finish Sn/Pb, 85/15
STMicroelectronics
Original
STMicroelectronics marking code date CHN G4 chn 509 marking code stmicroelectronics Date Code Marking STMicroelectronics CHN 450 MPG-EEP/04/578 M50FW M50LPW M50FLW TSOP40 MPG/EE/0086