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LTC3444EDD#PBF Linear Technology LTC3444 - Micropower Synchronous Buck-Boost DC/DC Converter for WCDMA Applications; Package: DFN; Pins: 8; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC3444EDD#TRPBF Linear Technology LTC3444 - Micropower Synchronous Buck-Boost DC/DC Converter for WCDMA Applications; Package: DFN; Pins: 8; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC3444EDD Linear Technology LTC3444 - Micropower Synchronous Buck-Boost DC/DC Converter for WCDMA Applications; Package: DFN; Pins: 8; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC3444EDD#TR Linear Technology LTC3444 - Micropower Synchronous Buck-Boost DC/DC Converter for WCDMA Applications; Package: DFN; Pins: 8; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
ICL7135CPIZ Intersil Corporation 4 1/2 Digit, BCD Output, A/D Converter; PDIP28; Temp Range: 0° to 70° visit Intersil Buy
ISL6306IRZ-T Intersil Corporation 4-Phase PWM Controller with 8-Bit DAC Code for Precision RDS(ON) or DCR Differential Current; QFN40; Temp Range: See Datasheet visit Intersil Buy

STMicroelectronics marking code date

Catalog Datasheet MFG & Type PDF Document Tags

MYS 99

Abstract: STMicroelectronics marking code date assembly and test operations, ST clearly brands a date code on every device, as well as an encapsulation code on CAPHATTM products. STMicroelectronics is implementing a new marking and traceability scheme , marking illustrations Figure 1. QFN16 (3 x 3) package date code 1-digit Year (4 = 2004). 2 , ) marking information AN926 Previous (obsolete) marking information The 9-character date code (Figure , TSSOP date and assembly site code Assembly site (9 = Muar, Z = Bouskoura, B = Amkor, N = UTAC, Y =
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MYS 99 STMicroelectronics marking code date MYS 99 STMicroelectronics Date Code Marking STMicroelectronics STMicroelectronics date code format st marking code

STMicroelectronics marking code date

Abstract: Date Code Marking STMicroelectronics Philippines Forecasted date of change 30-Apr-2004 Forecasted date of samples for customer 30-Apr-2004 Forecasted date for STMicroelectronics change qualification report availability 30-May-2004 Marking to identify changed product see label and device marking in attached document Description of , 2004 for the M50FW080 and M50FLW040 Forecasted date for internal STMicroelectronics change , Attached List Manufacturing Location(s) Estimated Date of first shipment 30-May-2004 Division
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M50FW ST MICROELECTRONICS DATE CODE MARKING sumitomo crm epoxy Part Marking STMicroelectronics Ablebond 8360 marking code stmicroelectronics ablestik 8360 MPG-EEP/04/451 PLCC32 M50LPW M50FLW

MYS 99

Abstract: STMicroelectronics date code format traceability to specific assembly and test operations, ST clearly brands a date code on every device, as well as an encapsulation code on CAPHATTM products. STMicroelectronics is implementing a new marking and , APPLICATION NOTES NEW MARKING ILLUSTRATIONS Figure 1. QFN Package Date Code 1-digit Year (4 = 2004). 2 , . QFN Package Date Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8-Lead SOIC and TSSOP Date and Assembly Site Code. . . . . . . . . . . . . . .
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STMicroelectronics marking code STMicroelectronics marking code date diode AN926 APPLICATION NOTE INTEGRATED CIRCUIT DATE code stmicroelectronics Marking STMicroelectronics QFN QFN 8 CARSEM 24-/28-P 24-/44-P 18-/28-P 32-/36-P

STMicroelectronics marking code date

Abstract: CHN G4 ? Box Label Marking (new style). The box label contains the traceability code: PP YWWLLL WX TF Where , . Forecasted Date for the Internal STMicroelectronics Change, Qualification Report Availability: April 2004 , . WHY? STMicroelectronics EEPROM & Serial Non Volatile Memory Division strategy is to support the , qualified according to the STMicroelectronics, standard qualification procedure. The qualification report , ST TOA PAYOH Singapore (SGP) "GA" for AMKOR Shanghai China (CHN) DEVICE MARKING The topside
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CHN G4 chn 509 CHN 450 SUMITOMO G700 ablebond 8290 STMicroelectronics code date marking MPG-EEP/04/578 TSOP40 MPG/EE/0086 MPG/EEP/04/450

LD1117 marking ST

Abstract: STMicroelectronics marking code date ECOPACK specification for Lead-Free connections Forecasted date of change 02-Jan-2004 Forecasted date of samples for customer 12-Sep-2003 Forecasted date for STMicroelectronics change qualification report availability 12-Sep-2003 Marking to identify changed product Date code + letter "E" marking whenever possible Description of qualification program See Attached Qualification , for the ECOPACK devices will also be ensured by the date code, by the "ECOPACK" indication on the
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Z0109SN LD1117 marking ST STMicroelectronics SOT23 Marking CODE st LD1117 marking STMicroelectronics SOT23 DATE CODE Philips sot 23-5 package marking LD2980 marking DSG/03/288 BC547C ESDA14V2SC5 LD2980 TS951ILT

STMicroelectronics marking code date

Abstract: Marking STMicroelectronics QFN the change ECOPACK specification for Lead-Free connections Forecasted date of change 02-Jan-2004 Forecasted date of samples for customer 01-Oct-2003 Forecasted date for STMicroelectronics change qualification report availability 01-Oct-2003 Marking to identify changed product Date code + letter "E" marking whenever Description of qualification program See Attached Qualification Plan , body. The traceability for the ECOPACK devices will also be ensured by the date code, by the "ECOPACK"
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STG3699QTR ecopack OCT14 STMicroelectronics date marking CODE STMicroelectronics marking STMicroelectronics marking code dfn DSG/03/346 DSG-DIS/03/346 EMIF08-2005QCF

STMicroelectronics marking code date

Abstract: ipc SMB SMC ECOPACK specification for Lead-Free Forecasted date of change 17-Nov-2003 Forecasted date of samples for customer 28-Aug-2003 Forecasted date for STMicroelectronics change qualification report availability 28-Aug-2003 Marking to identify changed product Date code + letter "E" marking whenever , traceability for the ECOPACK devices will also be ensured by the date code, except for devices in MELF and , /or Part Number(s) See Attached List Manufacturing Location(s) Estimated Date of first shipment
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SMBJ12A SMBJ12AVCL TMBYV10-40FILM ipc SMB SMC smb marking stmicroelectronics STMicroelectronics TRACEABILITY code DSG-DIS/03/322 STPS1H100A STPS1L40U SM15T6V8A

STMicroelectronics marking code date

Abstract: Date Code Marking STMicroelectronics STMicroelectronics change Qualification Plan results availability Estimated date of changed product first shipment , ® PRODUCT/PROCESS CHANGE NOTIFICATION PCN MLD-MIC/05/1160 Notification Date 06/10/2005 , Notification Date 06/10/2005 Table 1. Change Identification Product Identification (Product Family , ) See attached Description of the Qualification Plan See attached Marking to identify changed , Chung Li Table 2. Change Implementation Schedule Forecasted implementation date for change 18
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STMicroelectronics marking code date me LOT code stmicroelectronics STMicroelectronics PRODUCT code date STMicroelectronics date CODE Wafer Fab Plant Codes ST upsd PSD3200 PSD3300 PSD3400

STMicroelectronics marking code date

Abstract: Date Code Marking STMicroelectronics Recommendations Dot, ST logo xx = marking z = packaging location yww = date code (y = year ww = week , Ordering code Marking Package Weight Base qty Delivery mode EMIF04-VID01C1 GU , ) 8kV (contact discharge) ® Coated Flip-Chip (10 Bumps) Table 1: Order Code Part Number EMIF04-VID01C1 Marking GU Figure 1: Pin Configuration (ball side) 6 5 4 I3 I4 3 I2 , trademark of STMicroelectronics. February 2005 REV. 1 1/6 EMIF04-VID01C1 Table 2: Absolute
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AN1235 AN1751 ipad data sheet lcd ipad Marking STMicroelectronics Analog devices Marking Information EMI filter 500 900Mhz 900MH IEC61000-4-2

STMicroelectronics marking code date

Abstract: marking code stmicroelectronics packaging location yww = date code (y = year ww = week) 365 240 365 Copper pad Diameter , unreeling All dimensions in mm Table 4: Ordering Information Ordering code Marking Package , integration & wafer level packaging ® Flip-Chip (15 Bumps) Table 1: Order Code Part Number EMIF06-VID01F2 Marking GR Figure 1: Pin Configuration (ball side) 9 8 7 I5 I6 6 I4 , 16pF typ. @ 3V MIL STD 883E - Method 3015-6 Class 3 TM: IPAD is a trademark of STMicroelectronics
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marking code stmicroelectronics

Abstract: STMicroelectronics marking code date BOM ® Flip-Chip (10 Bumps) Table 1: Order Code Part Number EMIF04-VID01F2 Marking GU , ± 50µm Figure 10: Foot Print Recommendations Dot, ST logo xx = marking z = packaging location yww = date code (y = year ww = week) 365 240 365 Copper pad Diameter : 250µm , unreeling All dimensions in mm Table 4: Ordering Information Ordering code Marking Package , trademark of STMicroelectronics. February 2005 REV. 1 1/6 EMIF04-VID01F2 Table 2: Absolute
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STMicroelectronics date code format

Abstract: STMicroelectronics date code Availability Date of Samples for Customer: October, 2003 Forecasted Date for Internal STMicroelectronics , . Date Code Change: See attached. Description of the Qualification Program: According to ST , CLOCKS AND NVRAM SUPERVISORS IN EMBEDDED CRYSTAL PACKAGES WHAT IS THE CHANGE? STMicroelectronics is , ? Qualification is being done according to STMicroelectronics Corporate procedure. IMPACT ESTIMATION AT USER , (representing ECOPACK®) branded onto the IC packages. The brand includes the trace code, and has the format
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M41ST85WMX6 M41ST87YMX6 M41ST85WMX6TR M41ST85YMX6 M41ST85YMX6TR stmicroelectronics assembly site date code format AI08874 STMicroelectronics marking code date nvram trace code STMicroelectronics trace code format inner bulk box labeling MPG/SR/2003005 SOX28 M41ST95WMX6

STMicroelectronics marking code date

Abstract: AN1235 : Order Code Part Number EMIF04-VID01F2 Marking GU Figure 1: Pin Configuration (ball side) 6 , 250µm ± 50 1.92mm ± 50µm Figure 10: Foot Print Recommendations Dot, ST logo xx = marking z = packaging location yww = date code (y = year ww = week) 365 240 365 Copper pad Diameter , unreeling All dimensions in mm Table 4: Ordering Information Ordering code Marking Package , MIL STD 883E - Method 3015-6 Class 3 TM: IPAD is a trademark of STMicroelectronics. February
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STMicroelectronics marking code date

Abstract: Date Code Marking STMicroelectronics Recommendations Dot, ST logo xx = marking z = packaging location yww = date code (y = year ww = week , Ordering code Marking Package Weight Base qty Delivery mode EMIF06-VID01C1 GR , ) 8kV (contact discharge) ® Coated Flip-Chip (15 Bumps) Table 1: Order Code Part Number EMIF06-VID01C1 Marking GR Figure 1: Pin Configuration (ball side) 9 8 7 I5 I6 6 I4 , 100 CLINE = 16pF typ. @ 3V TM: IPAD is a trademark of STMicroelectronics. February 2005 REV
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DATE code stmicroelectronics EMIF06

PSDSoft

Abstract: uPSD3253B-40T6 attached Change Product Identification Part Marking Manufacturing Location(s) Table 2. Change Implementation Schedule Forecasted implementation date for change 01-Mar-2007 Forecasted availabillity date of samples for customer 01-Mar-2007 Forecasted date for STMicroelectronics change , ® PRODUCT/PROCESS CHANGE NOTIFICATION PCN MPA-MIC/06/2229 Notification Date 12/19/2006 uPSD3x54 Bond Pad Re-layout MIC - MICROCONTROLLERS 1/7 PCN MPA-MIC/06/2229 - Notification Date 12
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PSDSoft uPSD3253B-40T6 uPSD325x UPSD3454EVB40U6 uvision uPSD notification PSD325 PSD335 PSD345

BYW98-100

Abstract: stth302c produced with the new die will be identified by the date code of the component as indicated below: Die Technology Current Planar Date code Pyww Pyww. Marking P = manufacturing site (China) y =last digit of , Forecasted date for internal STMicroelectronics change qualification report availability Marking to identify changed product E.G. date code change Description of the qualification program Product Line(s) and/or Part , date code Traceability is also ensured through QA number Reliability test plan is attached to PCN
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BYW98-100 stth302c BYW100-150 diode 400v 2A ultrafast BYT01-400 BYW98-150 DSG/AD/1006B DSG/AD/1006 DO-15 DO-201AD DSG/AS/0006

STMicroelectronics marking code date

Abstract: Date Code Marking STMicroelectronics SILICON LINE Forecasted date of change WK41 2000 Availability date of samples for customer WK 50 1999 Forecasted date for internal STMicroelectronics change qualification report availability reliability report (family report) Marking to identify changed product E.G. date code change LETTERS , : ALL CUSTOMERS INVOLVED IN THE ABOVE MENTIONED PART NUMBER. WHEN: THE FORECAST DATE FOR CHANGE IS WEEK , BE IDENTIFIED IN THE MARKING WITH THE LETTERS "C" AS FIRST DIGIT OF DATE-CODE. WHERE: NO LOCATION
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IRF820 stmicroelectronics datecode SOP271 ST datecode Part Marking ST mosfets 0C27 DSG/CT/0C27

uvision

Abstract: uPSD3212 Product change will be ID by date code Manufacturing Location(s) Table 2. Change Implementation Schedule Forecasted implementation date for change 18-Sep-2006 Forecasted availabillity date of samples for customer 21-Aug-2006 Forecasted date for STMicroelectronics change Qualification Plan , ® PRODUCT/PROCESS CHANGE NOTIFICATION PCN MPA-MIC/06/1938 Notification Date 07/18/2006 , /1938 - Notification Date 07/18/2006 Table 1. Change Identification Product Identification (Product
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uPSD3212 FLASHLINK uPSD3200 uPSD3212C-40T6 uPSD3212CV-24T6 uPSD3212CV-24U6 PSD3212 PSD3312 PSD3422 MPA-MIC/06/1574

STMicroelectronics marking code date so-14

Abstract: marking GU = packaging location yww = date code (y = year ww = week) 240 Solder stencil opening , mm te le Table 4: Ordering Information Ordering code Marking EMIF04-VID01C1 GU so , discharge) 8kV (contact discharge) bs O Marking GU ro P Figure 1: Pin Configuration (ball side) ct du o uc d Table 1: Order Code Part Number EMIF04-VID01C1 s) t( 6 5 , TM: IPAD is a trademark of STMicroelectronics. February 2005 REV. 1 1/6 EMIF04-VID01C1
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STMicroelectronics marking code date so-14 marking GU AN-1751

STMicroelectronics marking code date

Abstract: marking code stmicroelectronics Dot, ST logo xx = marking z = packaging location yww = date code (y = year ww = week) 365 240 , Ordering code EMIF06-VID01F2 Marking GR Package Flip-Chip Weight 5.4 mg Base qty 5000 Delivery mode Tape & , (contact discharge) MIL STD 883E - Method 3015-6 Class 3 Flip-Chip (15 Bumps) Table 1: Order Code Part Number EMIF06-VID01F2 Marking GR Figure 1: Pin Configuration (ball side) 9 8 7 6 5 4 3 2 1 I6 , STMicroelectronics. February 2005 REV. 1 1/6 EMIF06-VID01F2 Table 2: Absolute Ratings (limiting values
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STMicroelectronics PART marking
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