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Omron says USB environmental sensor monitors seven functions

Omron Electronic Components Europe has introduced a new version of its USB multi-function environmental sensor that that can monitor seven parameters. The 2JCIE-BU01 offers multiple sensors in one unit that has built-in memory and connectivity through beacon communication. It  measures 14.9 x 29.1 x 7.0mm and can monitor temperature, humidity, light, UV, barometric pressure, noise, ...

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Connectors withstand six hours of 10G vibrational force

Harwin's new M225 connectors are of withstanding a 10G vibrational force for a period of 6 hours

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Redpine Signals launches multi-core SmartMCU series

Redpine Signals of San Jose Has launched its RS12000 series of SmartMCUs based on an optimised multi-core IoT processor architecture. RS12000 series features an ARM-Cortex M4 running up to 250MHz, sensor hub DSP offload at 125MHz, a four-threaded security and network processor running up to 160MHz, and a full suite of analogue and digital peripherals. The ...

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ST adds to STM32 MCU series

ST has added to its STM32L5 MCU series based on the Cortex-M33 core by adding flexible software isolation, secure boot, key storage, and hardware cryptographic accelerators. Consuming as little as 33nA in shutdown mode and achieving 402 ULPMark-CP in the EEMBC1 ULPBench, the new MCU series exploits low-power techniques such as adaptive voltage scaling, real-time acceleration, ...

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BCL expands ABS enclosure business

BCL Distribution, the specialist UK manufacturer of standard and custom plastic enclosures, has announced the expansion of its ABS enclosure business and the appointment of a new team dedicated to focusing on the BCL Distribution Box business. BCL’s range of enclosures include: multipurpose and small multipurpose boxes with lids in ABS for maximum strength; general ...

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MagnaChip launches HV Super Junction MOSFET

MagnaChip of Seoul has introduced of a High-Voltage Super Junction MOSFET with a 900V breakdown voltage and low total gate charge (Qg) (“90R1K4P”). The device with two package types, I-PAK and D-PAK, will sample to customers in November 2018 and will be manufactured in high volume in early first quarter of next year. 90R1K4P features ...

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Image sensor claimed to work equally well in all lighting conditions

A 2.9-micron, 2MP image sensor with ultra-low-light technology

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Jensen Huang: Moore’s law is dead – long live AI

GPU Technology Conference, Munich: According to Nvidia founder and CEO, Jensen Huang, there are two dynamics controlling the computing industry today – the end of Moore’s law and software that can write itself, artificial intelligence, or AI. Moore’s law – which states that the density of a chip doubles every two years, while decreasing in ...

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ROHM re-brands hi-fi DACs

ROHM has launched a new branding “MUS-IC” reflecting ROHM’s focus on solutions for high-fidelity audio products. This branding covers a range of D/A converter ICs (DAC ICs), optimized for high-fidelity reproduction, and power supply products. The increased adoption of high-resolution audio sources has lately strengthened the demand for audio equipment that can deliver an appropriate ...

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EDS: Video Interview – Lascar Electronics on graphical interfaces, wireless data logging

At Engineering Design Show 2018, we caught up with Jonathan Abbott at Lascar Electronics

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